Tezzaron at the Instrumentation Frontier Mar11 By Webmaster • Posted in Tezzaron in the News March 11, 2014 3D pixel-readout chip, designed by Fermilab consortium, built by Tezzaron “…Fermilab organized an international consortium of a dozen physics laboratories to produce a demonstration 3D pixel-readout chip. They chose Tezzaron Semiconductor, a leader in the 3D field, as an industrial partner…” Read the article in … [Read More]
INFIERI in Madrid Jan21 By Webmaster • Posted in Tezzaron Presents January 21, 2014 Tezzaron presents “New Developments from Tezzaron” and “3D Vertical Interconnect Software Kits” at the INFIERI Workshop in Madrid: “Intelligent Front-End Signal Processing for Frontier Exploitation in Research and Industry
Tezzaron in the News: 2013 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2013 December 2013: 2.5-D Stacks Pile Up at Event (EE Times) December 2013: Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action (3D InCites) December 2013: Invensas and Tezzaron Partner to Deliver Commercial 3D IC Products (3D InCites) December 2013: Ziptronix Teams with Tezzaron and Novati Technologies … [Read More]
3D ASIP Dec12 By Webmaster • Posted in Tezzaron Presents December 12, 2013 Tezzaron presents “Evolving 2.5D and 3D Integration” at 3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
Invensas Teams with Tezzaron Dec12 By Webmaster • Posted in Press Releases December 12, 2013 Invensas announced that it is partnering with Tezzaron to build a wide range of 3D-IC customer products. Robert Patti of Tezzaron: “Today we can produce complete high-quality 2.5D (Silicon Interposer) and 3D silicon devices, but the final packaging flows are lacking. Invensas’ 3D-IC packaging expertise and existing pilot assembly line … [Read More]