Industry News

Celebrating the 3D-IC Alliance

In 2005, Tezzaron and Ziptronix formed the 3D-IC Alliance to promote standards in 3D IC design and manufacturing – a necessary endeavor that was not being promoted elsewhere. More than a dozen groups joined the Alliance. In 2008, the Alliance announced the first standard ever published for 3D-ICs: [Read More]

Competing in the Global Market

Semiconductor technology is a powerful and growing force in the world economy. Smart devices, the Internet, and the looming Internet of Things are global engines of economic progress – and they stand on the bedrock of semiconductors.
On Oct 25, the U.S. Council on Competitiveness met in Chicago as part … [Read More]

It’s All About the Memory!

Remember when CPU speed was all-important?  Things have changed.  The mighty CPU is no longer the center of the computing universe; nowadays it’s all about the memory.  (A Tezzaron memory chip is pictured above.)  Memory-centric architectures are on the rise, as described by Ed Sperling in his latest … [Read More]

Early alert: 3DIC 2016

The IEEE International Conference on 3D System Integration (3DIC 2016) will be held in San Francisco on November 8-10, 2016.  Conference co-chairs are Paul Franzon of NCSU and our own Bob Patti.  The conference will cover all 3D-IC topics including 3D process technology, materials, … [Read More]