Author Archives: Webmaster

Tezzaron at the GSA Silicon Summit

“At the GSA Silicon Summit this afternoon there was a discussion of 3D IC and 2.5D IC. The session was moderated by Javier DeLaCruz of eSilicon and the panelists were:

Calvin Cheung of ASE (an OSAT)
Gil Lvey of OptimalTest (a test house)
Bob Patti of Tezzaron (semiconductor company specializing in TSV-based designs)
Riko … [Read More]

Tezzaron Builds 3D Sensors for Fermilab

“Each of the integrated circuits you see here is about 6 millimeters on a side and projects one one-thousandth of an inch above the surface of the larger sensor wafer on which it sits … Fermilab is behind the novel concept of the detector devices and design, which are known … [Read More]

3D transistors, 3D chips, and 2.5D

“From the ultra-small 3D transistors described in papers at this month’s International Electron Devices Meeting (IEDM) in Washington, D.C., to the 2.5D and 3D multichip structures described at the 3D Architectures for Semiconductor Integration and Packaging (ASIP) conference held in Burlingame, Calif., designers are finding more ways to pack more … [Read More]