The Tezzblog

Is 7nm the Last Major Node?

The title of this post is stolen from an article by Ed Sperling, published in Semiconductor Engineering, July 20, 2017. I reference it here to cite it as recommended reading.

The list of problems with semiconductor processes beyond 10nm seem overwhelming. New nodes have always looked difficult to achieve, but I … [Read More]

Tezzaron’s 3D Processes & Patents

Bill Martin discussed (in 3D InCites) the IP and patent landscape of electronic system development. One case in point was a comparison of the 3D processes used by Tezzaron and Monolithic 3D. He concludes that the two companies “do not need to chase the smaller nodes … that … [Read More]

Celebrating the 3D-IC Alliance

In 2005, Tezzaron and Ziptronix formed the 3D-IC Alliance to promote standards in 3D IC design and manufacturing – a necessary endeavor that was not being promoted elsewhere. More than a dozen groups joined the Alliance. In 2008, the Alliance announced the first standard ever published for 3D-ICs: [Read More]