Mentor and Tezzaron Optimize Calibre 3DSTACK for 2.5/3D-ICs May20 By Webmaster • Posted in Press Releases May 20, 2013 WILSONVILLE, Ore., May 20, 2013 Mentor Graphics Corp. (NASDAQ: MENT) and Tezzaron Semiconductor Corp. today announced they are collaborating to integrate the Mentor® Calibre® 3DSTACK product into Tezzaron’s 3D-IC offerings. The new integration will focus on fast, automated verification of die-to-die interactions in 2.5D and 3D stacked die configurations by verifying … [Read More]
Fabricating 2.5D, 3D, 5.5D Devices Apr15 By Webmaster • Posted in Tezzaron Presents April 15, 2013 Tezzaron presents “Fabricating 2.5D, 3D, 5.5D Devices” to the Global Semiconductor Alliance
Tezzaron Touted at AIDA Apr8 By Webmaster • Posted in Tezzaron Presents April 8, 2013 Tezzaron is represented at “AIDA – Academia meets Industry” in Italy with a presentation: “Implementing 2.5D and 3D Devices”
INFIERI 2013 Feb27 By Webmaster • Posted in Tezzaron Presents February 27, 2013 Tezzaron participates in the inaugural meeting of the international INFIERI project in Paris and presents “3D Technology: Where do we stand?”
Novati Announces Licensing Agreement Jan16 By Webmaster • Posted in Industry News January 16, 2013 Novati (Tezzaron’s Austin fab) announces a licensing agreement with Ziptronix.