Ziptronix Teams with Tezzaron and Novati Technologies to Accelerate Development of 3D ICs Dec9 By Webmaster • Posted in Press Releases December 9, 2013 Sells 3D IC development lab to Tezzaron; Novati Technologies to operate facility Ziptronix Inc., provider of patented, low- temperature direct bonding technology for 3D integration, today announced an agreement with Tezzaron Semiconductor Corporation and Novati Technologies, a wholly owned subsidiary of Tezzaron, as a next step toward the acceleration of 3D … [Read More]
IEEE Santa Clara Valley Presentation Nov13 By Webmaster • Posted in Slide Presentations November 13, 2013 IEEE Santa Clara Valley PDF Presentation: Design, Manufacturing and Performance of a 3D Random Access Memory Subsystem
IEEE Santa Clara Valley Nov13 By Webmaster • Posted in Tezzaron Presents November 13, 2013 Tezzaron presents “Design, Manufacturing and Performance of a 3D Random Access Memory Subsystem” at IEEE Santa Clara Valley
IEEE 3D System Integration Conference Oct3 By Webmaster • Posted in Tezzaron Presents October 3, 2013 Tezzaron presents “A Perspective on Manufacturing 2.5/3D” at the IEEE 3D System Integration Conference (2013); we also chair a Test session and participate in a panel
3D-IC Video Processor Aug30 By Webmaster • Posted in Tezzaron in the News August 30, 2013 Tezzaron is very excited about a phenomenal “smart video” device built in our FaStack technology! Johns Hopkins University (JHU) and Universidad Nacional del Sur (UNS) worked together to develop a sensor-plus-processor in a single 3D-IC. The 2×2.5mm chip captures images and can process 30,000 frames per second! A prototype was built … [Read More]