Another Giant Step Toward 3-D Silicon Jun29 By Webmaster • Posted in Press Releases June 29, 2003 Vertical interconnects are tiny, precise, abundant A set of multi-wafer stacks – the first ever built with vertical through-silicon connections – demonstrates the electrical connectivity needed for tightly integrated 3-D semiconductor chips. The wafer stacks were created by Tezzaron Semiconductor using proprietary processes developed by that company. Before being bonded into … [Read More]
DRAM Pricing Sep15 By Webmaster • Posted in Documents September 15, 2002 A Tezzaron white paper View pdf document: DRAM Pricing