Tezzaron Presents

INFIERI in Madrid

Tezzaron presents “New Developments from Tezzaron” and “3D Vertical Interconnect Software Kits” at the INFIERI Workshop in Madrid: “Intelligent Front-End Signal Processing for Frontier Exploitation in Research and Industry

ConFab 2013

Tezzaron presents “Why 2.5D and 3D Semiconductors Are Changing Everything” at ConFab 2013 in Las Vegas, NV

DAC 2013

Tezzaron presents “Where Are All of Those 3D Chips?” at a special session in DAC 2013 in Austin, TX


Tezzaron participates in the inaugural meeting of the international INFIERI project in Paris and presents “3D Technology: Where do we stand?”