Tezzaron presentation to Potomac Institute Jun3 By Webmaster • Posted in Tezzaron Presents June 3, 2016 On May 27, Bob Patti of Tezzaron presented a Hardware Security Symposium at the Potomac Institute for Policy Studies. “Microelectronics are key components in our defense systems, and assuring that they are both readily available and secure is critical for US national security. Hardware-based threats can have … [Read More]
INFIERI in Madrid Jan21 By Webmaster • Posted in Tezzaron Presents January 21, 2014 Tezzaron presents “New Developments from Tezzaron” and “3D Vertical Interconnect Software Kits” at the INFIERI Workshop in Madrid: “Intelligent Front-End Signal Processing for Frontier Exploitation in Research and Industry
3D ASIP Dec12 By Webmaster • Posted in Tezzaron Presents December 12, 2013 Tezzaron presents “Evolving 2.5D and 3D Integration” at 3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
IEEE Santa Clara Valley Nov13 By Webmaster • Posted in Tezzaron Presents November 13, 2013 Tezzaron presents “Design, Manufacturing and Performance of a 3D Random Access Memory Subsystem” at IEEE Santa Clara Valley
IEEE 3D System Integration Conference Oct3 By Webmaster • Posted in Tezzaron Presents October 3, 2013 Tezzaron presents “A Perspective on Manufacturing 2.5/3D” at the IEEE 3D System Integration Conference (2013); we also chair a Test session and participate in a panel
ConFab 2013 Jun25 By Webmaster • Posted in Tezzaron Presents June 25, 2013 Tezzaron presents “Why 2.5D and 3D Semiconductors Are Changing Everything” at ConFab 2013 in Las Vegas, NV
DAC 2013 Jun6 By Webmaster • Posted in Tezzaron Presents June 6, 2013 Tezzaron presents “Where Are All of Those 3D Chips?” at a special session in DAC 2013 in Austin, TX
Fabricating 2.5D, 3D, 5.5D Devices Apr15 By Webmaster • Posted in Tezzaron Presents April 15, 2013 Tezzaron presents “Fabricating 2.5D, 3D, 5.5D Devices” to the Global Semiconductor Alliance
Tezzaron Touted at AIDA Apr8 By Webmaster • Posted in Tezzaron Presents April 8, 2013 Tezzaron is represented at “AIDA – Academia meets Industry” in Italy with a presentation: “Implementing 2.5D and 3D Devices”
INFIERI 2013 Feb27 By Webmaster • Posted in Tezzaron Presents February 27, 2013 Tezzaron participates in the inaugural meeting of the international INFIERI project in Paris and presents “3D Technology: Where do we stand?”