Tezzaron Presents

INFIERI in Madrid

Tezzaron presents “New Developments from Tezzaron” and “3D Vertical Interconnect Software Kits” at the INFIERI Workshop in Madrid: “Intelligent Front-End Signal Processing for Frontier Exploitation in Research and Industry

DAC 2013

Tezzaron presents “Where Are All of Those 3D Chips?” at a special session in DAC 2013 in Austin, TX


Tezzaron participates in the inaugural meeting of the international INFIERI project in Paris and presents “3D Technology: Where do we stand?”