Committed to 3D Jun26 By Webmaster • Posted in Industry News June 26, 2015 “Once you’ve made the decision to go 3D there’s no way back.” That’s the word from Eric Beyne, Scientific Director Advanced Packaging & Interconnect for imec. He went on to say: “If you need high-bandwidth memory, for example, then you’re committed to some sort of 3D.” We couldn’t agree more! Read … [Read More]
Tezzaron at InterPACK Jun3 By Webmaster • Posted in Tezzaron in the News June 3, 2015 This year’s InterPACK (International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems) is July 6-9 in San Francisco, held jointly with the International Conference on Nanochannels, Microchannels and Minichannels (ICNMM). It promises a fascinating array of papers, presentations, seminars, speakers, tutorials, and workshops. … [Read More]
3D at the Large Hadron Collider May18 By Webmaster • Posted in Slide Presentations May 18, 2015 April 27-29 2015 saw the Vth INFIERI Workshop in Geneva, Switzerland – home of CERN and its Large Hadron Collider. The high-level workshop was organized by the INFIERI consortium. Three days of plenary sessions covered the latest developments in detectors, imaging, data … [Read More]
Tezzaron’s Tungsten Interconnect in the News May13 By Webmaster • Posted in Tezzaron in the News May 13, 2015 Monolithic 3D (M3D), wafer-stacking with TSV (3DIC), and other buzz-worthy technologies are examined in the latest blog entry by Françoise von Trapp – “Queen of 3D.” She quotes some leading industry experts and notes: “Tezzaron’s 1µm tungsten TSVs are another attractive alternative in between 3DIC and M3D … currently, the … [Read More]
Tezzaron Reports on ReRAM May6 By Webmaster • Posted in Tezzaron in the News May 6, 2015 Paula Doe, technology director at SEMI, published a SEMICON West Preview on May 5. It featured a good summary of our oxygen vacancy ReRAM effort, including this line: “Patti says his company’s aerospace/military customers, who … [Read More]