The Tezzblog

Tezzaron’s Tungsten Interconnect in the News

Monolithic 3D (M3D), wafer-stacking with TSV (3DIC), and other buzz-worthy technologies are examined in the latest blog entry by Françoise von Trapp – “Queen of 3D.” She quotes some leading industry experts and notes: “Tezzaron’s 1µm tungsten TSVs are another attractive alternative in between 3DIC and M3D … currently, the only 3DIC processes in real production use [tungsten] TSV: Tezzaron and IBM.”  See the report in 3D InCites: Spotlight on FOWLP, Monolithic 3D IC and 3D TSVs