The Tezzblog

Committed to 3D

“Once you’ve made the decision to go 3D there’s no way back.”

That’s the word from Eric Beyne, Scientific Director Advanced Packaging & Interconnect for imec.  He went on to say: “If you need high-bandwidth memory, for example, then you’re committed to some sort of 3D.”

We couldn’t agree more!

Read the article here: 3DIC Technology Drivers and Roadmaps

Read about Tezzaron’s 3D memory here: DiRAM4™ 3D Memory

Mr. Beyne and Tezzaron’s CTO, Bob Patti, are both scheduled to talk about 3D technology at SEMICON West in July.