Committed to 3D Jun26 By Webmaster • Posted in Industry News June 26, 2015 “Once you’ve made the decision to go 3D there’s no way back.” That’s the word from Eric Beyne, Scientific Director Advanced Packaging & Interconnect for imec. He went on to say: “If you need high-bandwidth memory, for example, then you’re committed to some sort of 3D.” We couldn’t agree more! Read the article here: 3DIC Technology Drivers and Roadmaps Read about Tezzaron’s 3D memory here: DiRAM4™ 3D Memory Mr. Beyne and Tezzaron’s CTO, Bob Patti, are both scheduled to talk about 3D technology at SEMICON West in July.