Looking Forward Oct22 By Webmaster • Posted in Tezzaron in the News October 22, 2015 In “Seeking Alpha,” Robert Castellano says: “Looking forward, in the semiconductor space, one of the most challenging technologies with the greatest upside is 3D …” He specifically highlights “… 3D chip packaging using through silicon via technology (TSV) by UMC (NYSE:UMC), STATS ChipPAC, and Tezzaron.” See the article here.
Is Tezzaron’s 3D process “monolithic”? Oct15 By Webmaster • Posted in Industry News October 15, 2015 In the world of 3D ICs, definitions tend to morph and shift at a dizzying rate. There is disagreement on such basic terms as TSV, package, stack, and even 3D itself! The recent IEEE 3D Test Workshop saw a redefinition of “Monolithic 3D IC” that would include … [Read More]
Advanced Integrated Sensor Platform Sep30 By Webmaster • Posted in Industry News September 30, 2015 Novati Technologies (Tezzaron’s manufacturing subsidiary) announced a new wafer-stacked sensor technology that they will present at SEMICON Europa. The technology places sensors onto multi-layer stacks to consume less power, perform significantly faster, and reduce overall footprint. This is an exciting development with great promise … [Read More]
Tezzaron 3D Memory Chips in EE Times Sep30 By Webmaster • Posted in Tezzaron in the News September 30, 2015 Following up on our 8-layer stack press release, a glowing EE Times article provides great coverage of the work being done by Tezzaron and Novati. Dave Anderson (Novati CEO) is quoted at length about the wide range of exciting technologies performed at the Austin … [Read More]
More Synergy in 3D Sep4 By Webmaster • Posted in Tezzaron in the News September 4, 2015 Tezzaron works closely with both Ziptronix and Invensas – and now the parent of Invensas (Tessera) has acquired Ziptronix! This link-up is good news for the 3D community and further strengthens Tezzaron’s relationships. See the 3D InCites report: With the Acquisition of Ziptronix, Tessera … [Read More]