Tezzaron at InterPACK Jun3 By Webmaster • Posted in Tezzaron in the News June 3, 2015 This year’s InterPACK (International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems) is July 6-9 in San Francisco, held jointly with the International Conference on Nanochannels, Microchannels and Minichannels (ICNMM). It promises a fascinating array of papers, presentations, seminars, speakers, tutorials, and workshops. Herb Reiter leads one of the many panel discussions: Is Die-package Co-design the Key for Cost-effective Multi-die ICs? (Scroll down to Panel 9-1-7) Tezzaron’s Bob Patti is featured, along with Jan Vardaman, John Ferguson, Tom Gregorich, and Rich Rice. If you’re attending InterPACK, be sure to set aside time for this informative and no doubt lively discussion.