Good press for Tezzaron’s 8-layer wafer stack Sep1 By Webmaster • Posted in Tezzaron in the News September 1, 2015 Yesterday’s press release stirred up interest and press coverage at home and abroad. Click below for an especially interesting article written by Francoise von Trapp in 3D InCites: Move Over 3D Memory, Logic-on-Logic Stacks Have Arrived! Other coverage included: AZO NANO, Beijing Bulletin, IHS … [Read More]
Tezzaron Announces World’s First Eight-Layer Active Wafer Stack Aug31 By Webmaster • Posted in Press Releases August 31, 2015 Tezzaron and Novati announce an 8-layer wafer stack containing high-performance CMOS logic — the most wafers ever assembled in such a stack! There are no wire bonds, copper pillars, bumps, or underfill between the layers, just ultra-thin wafers with circuitry, connected vertically with tiny tungsten SuperContacts™. This is the densest … [Read More]
Memory wall? What memory wall? Aug28 By Webmaster • Posted in Tezzaron in the News August 28, 2015 Back in 1994, William Wulf and Sally McKee described the “Memory Wall” that hobbled computer performance. Francoise von Trapp now describes how that wall is being conquered in 3D by Tezzaron and others. See her article: With 3D Memory Cubes You Can Finally Break Down the … [Read More]
Surprises in 2.5D Aug18 By Webmaster • Posted in Tezzaron in the News August 18, 2015 What’s 2.5D, and why is it suddenly so poplar? Semiconductor Engineering says the stacked die approach is steadily gaining share, “but there are lots of surprises as to where, how and why.” Silicon interposers are the big winner. They quote our own Bob Patti: “People are becoming a … [Read More]
Tezzaron gets a nod from “Illinois Homes” Aug12 By Webmaster • Posted in Tezzaron in the News August 12, 2015 Illinois Homes is one of the top sites for Naperville Real Estate. They do more than promote real estate transactions — they highlight dozens of special reasons to be proud of our state. Today they featured a nice piece about Tezzaron and our “More than … [Read More]