Tezzaron in the News: 2005 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2005 November-December 2005: 3D Integration (IEEE Design & Test special issue) October 2005: Real Demand Drivers Appear for 3D ICs… (Wafer News and Solid State Technology) June 2005: Startup Profiles: Tezzaron (Semiconductor Times) June 2005: Three-Dimensional ICs Solve the Interconnect Paradox (Semiconductor International) May 2005: Terrazon [sic] applies 3D stacking … [Read More]
Tezzaron Inks Sales Rep Contracts for SRAM Sep19 By Webmaster • Posted in Press Releases September 19, 2005 Naperville, IL – September 19, 2005 Tezzaron’s memory products have attracted a team of world-class sales firms, giving the company an outside sales force of more than 50 people. The team includes Centaur North, Electronics Sales Professionals (ESP), Synergy Technical Sales, and TriStar Group. The firms average over 15 years’ experience … [Read More]
Tezzaron, PICC to Collaborate on 3D Flash Memory May9 By Webmaster • Posted in Press Releases May 9, 2005 Naperville, IL – May 9, 2005 Two innovative young companies, Tezzaron Semiconductor and Programmable Integrated Circuit Company (PICC), intend to collaborate on the creation of 3D flash memory components. The companies have executed a Letter of Intent outlining their agreement. PICC, a new “fabless” semiconductor company, owns patented flash technology that employs … [Read More]
Ziptronix®, Tezzaron® Announce Alliance for 3D ICs Feb28 By Webmaster • Posted in Press Releases February 28, 2005 Technologies called “compatible and complementary” 28 February 2005 Two leading forces in 3D integrated circuits, Tezzaron and Ziptronix, today announced their intent to cooperate in joint development and marketing efforts. As pioneers in 3D IC technology, both companies are working towards a general industry adoption of 3D solutions. The collaboration … [Read More]
Tezzaron® Unveils 3D SRAM Jan24 By Webmaster • Posted in Press Releases January 24, 2005 Third 3D IC Confirms FaStack™ Process Naperville – 24 January 2005 Tezzaron Semiconductor has built a 1 Megabit SRAM as a three-dimensional integrated circuit (3D IC). This new device, the third design to be built in Tezzaron’s FaStack wafer stacking process, uses a 100-pin TQFP package with industry standard pinout and interface. Tezzaron … [Read More]