Tezzaron in the News: 2004 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2004 December 2004: Six 3D designs precede 90% power-saving claims from Tezzaron (EE Times) December 2004: RF applications will follow the 3D Interconnect path… (Mobile Dev & Design) December 2004: The ups and downs of three-dimensional circuits (EE Times) December 2004: Tezzaron debuts ‘super-8051’ chip with 3D technology (EE Times) November 2004: High-rise circuitry … [Read More]
3D Semiconductors Poised for Revolution Dec23 By Webmaster • Posted in Press Releases December 23, 2004 Singapore – 23 December 2004 Tezzaron® Semiconductor announced that its 3D technology is ready to launch the semiconductor industry into a new era. “Migration from 2D to 3D is inevitable,” says Dr. Subhash Gupta, Managing Director. His confidence is based on the success of Tezzaron’s first six prototype designs, which demonstrated … [Read More]
Third Dimension Triples Processor Speed Dec6 By Webmaster • Posted in Press Releases December 6, 2004 Naperville, IL – 6 December 2004 Tezzaron Semiconductor has demonstrated a new 8051-based microprocessor that is 2 to 10 times faster than typical 8051 designs, running at speeds of up to 140 MHz under lab conditions. The microprocessor’s secret is its three-dimensional architecture: the processor is on one layer and 128 … [Read More]
Tezzaron Launches RAM in a New Dimension Nov22 By Webmaster • Posted in Press Releases November 22, 2004 Naperville, IL – November 22, 2004 Tezzaron Semiconductor today announced the world’s first 3D-IC RAM chip. The re-programmable memory (RAM) device was built as a three-dimensional integrated circuit (3D IC) – two layers of circuitry with vertical interconnects that allow them to behave as a single device. This technology is expected … [Read More]
Techniques for Producing 3D ICs with High-Density Interconnect Oct31 By Webmaster • Posted in Documents October 31, 2004 A Tezzaron presentation from the 2004 VLSI Multi-Level Interconnection Conference (VMIC) Techniques for Producing 3D ICs with High-Density Interconnect