Author Archives: Webmaster

Novati Technologies Licenses Ziptronix’s Direct Oxide Bonding (ZiBond®) and Direct Bond Interconnect (DBI®) Patented Technologies For Advanced 3D Integrated Assemblies

RESEARCH TRIANGLE PARK, N.C. – Jan. 16, 2013

Ziptronix, Inc. has signed a licensing agreement with Novati Technologies, Inc. for the use of its patents covering direct bonding technology, ZiBond® and DBI®.

“We believe that Ziptronix’s patented direct bonding technology enables the industry’s best performance for applications such as 3D memory, BSI … [Read More]

Ziptronix Licenses DBI® and ZiBond® to Tezzaron

Ziptronix Licenses Direct Bond Interconnect (DBI®) and ZiBond® Patented Technologies to Tezzaron Semiconductor for Advanced 3D Memory and 3D Integrated Assemblies

RESEARCH TRIANGLE PARK, N.C., December 12, 2012

Ziptronix, Inc. has signed a licensing agreement with Tezzaron Semiconductor for the use of patents regarding Ziptronix’s direct bonding technologies, ZiBond™ and DBI®.

“There is … [Read More]

Tezzaron Semiconductor Completes Acquisition of SVTC’s Austin Fab, Now Novati Technologies

Naperville, IL and Austin, TX (22 October, 2012)

Tezzaron Semiconductor’s acquisition of the former SVTC facility in Austin is complete. The fab now operates as a newly formed Texas corporation, “Novati Technologies, Inc.,” with Tezzaron as the sole shareholder of the corporation. The deal closed on Monday, Oct. 15, 2012.

The acquisition … [Read More]