The Tezzblog

Tezzaron at the GSA Silicon Summit

“At the GSA Silicon Summit this afternoon there was a discussion of 3D IC and 2.5D IC. The session was moderated by Javier DeLaCruz of eSilicon and the panelists were:

  • Calvin Cheung of ASE (an OSAT)
  • Gil Lvey of OptimalTest (a test house)
  • Bob Patti of Tezzaron (semiconductor company specializing in TSV-based designs)
  • Riko Radojcic of Qualcomm (you don’t need me to tell you what they do)
  • Arif Rahman of Altera (FPGAs, working with Intel on 3D apparently)
  • Brandon Wang of Cadence (where he is director of 3D IC solutions)”

read the article at