The Tezzblog

3D InCites covers the ITRS Roadmap

“At the beginning of April, the Semiconductor Industry Association released the 2013 International Roadmap for Semiconductors (ITRS) … the combination of 3D device architecture and low power devices will usher in a new era of scaling identified in short as ‘3D Power Scaling.’ … all roads point to reduced power as the most pressing need, and 3D SoC (aka 3D power scaling) will be the way to do it, whether they are 3D transistors, Monolithic 3D IC, or 3D stacked IC.”
read Francoise von Trapp’s article in 3D InCites