Tezzaron at Pixel 2014 Sep23 By Webmaster • Posted in Slide Presentations September 23, 2014 The International Workshop on Semiconductor Pixel Detectors for Particles and Imaging was held 1-5 September 2014 in Niagara Falls, Canada. Tezzaron presented 2.5D and 3D Integrated Circuit Technology Capablilities and Industry Readiness
Fermilab 3D Sensor Breakthrough Sep23 By Webmaster • Posted in Industry News September 23, 2014 A new 3D sensor prototype with extraordinary capabilities was recently revealed by Grzegorz Deptuch of Fermilab. The three-layer sensor, named VIPIC, is designed for particle detection in large-scale particle physics and x-ray imaging experiments. It exhibits higher and more uniform gain, higher signal amplitude, lower input capacitance, and much lower … [Read More]
COSMOS, DAHI, and mixed-material 3D Aug29 By Webmaster • Posted in Industry News August 29, 2014 A hotly-pursued goal of 3D-IC technology is the integration of circuitry built on different substrates. Phil Garrou reports in his blog, “Insights from the Leading Edge,” that DARPA is leading the way with its COSMOS and DAHI programs. Tezzaron and Novati are participants in these programs. You can read Phil’s … [Read More]
Stacked dies – a good discussion Aug7 By Webmaster • Posted in Industry News August 7, 2014 3D and 2.5D are “inevitable” according to Brian Bailey (in Semiconductor Engineering), but he wonders about the cost. His thoughtful article makes good reading. [See it here]
Novati named a “Trusted” Fab Aug5 By Webmaster • Posted in Tezzaron in the News August 5, 2014 Novati Technologies, Tezzaron’s manufacturing subsidiary in Austin, has been awarded the coveted “Trusted Foundry” accreditation. Novati is one of only nine companies so designated by the U.S. Department of Defense. “Trusted Foundries” are qualified to perform highest-security semiconductor production. You can read the Novati press release … [Read More]