The Tezzblog

COSMOS, DAHI, and mixed-material 3D

A hotly-pursued goal of 3D-IC technology is the integration of circuitry built on different substrates. Phil Garrou reports in his blog, “Insights from the Leading Edge,” that DARPA is leading the way with its COSMOS and DAHI programs. Tezzaron and Novati are participants in these programs.  You can read Phil’s blog on the Solid State Technology site [here].