3DIC Business Update Aug4 By Webmaster • Posted in Industry News August 4, 2014 A report from Research and Markets highlights the bright future of 3D and 2.5D.
Finally Saying It Out Loud Aug4 By Webmaster • Posted in Tezzaron in the News August 4, 2014 Tezzaron’s first working 3D memory chip – a memory stack with through-silicon vertical interconnect – appeared in 2004. Since then our memory stacks have grown continually more sophisticated, with hugely increased capacity. Finally, at the GSA 3D IC Packaging Working Group meeting (July 23), … [Read More]
Advances in Fusion Bonding Jul31 By Webmaster • Posted in Industry News July 31, 2014 Austria’s EV Group (EVG) supplies the excellent equipment Tezzaron uses for copper thermal diffusion bonding. Solid State Technology has published a story about their latest achievements: “Fusion bonding for next-generation 3D-ICs”
Are we “real”? Jul30 By Webmaster • Posted in Industry News July 30, 2014 Yes, Tezzaron is real! In a thoughtful “3D InCites” post, Francoise von Trapp says that 3D products in small niche markets are just as “real” as in high-volume manufacturing. (And industry spokespersons can’t agree on the definition of “high-volume” anyway.) You can read her entire article [Read More]
3D and the “Internet of Things” Jul29 By Webmaster • Posted in Industry News July 29, 2014 “IoT” is the hot new buzzword. How does 3D/2.5D fit into this paradigm? Herb Reiter makes some very good points in his 3D InCites article: …One Plus One is More Than Two