Looking Forward Oct22 By Webmaster • Posted in Tezzaron in the News October 22, 2015 In “Seeking Alpha,” Robert Castellano says: “Looking forward, in the semiconductor space, one of the most challenging technologies with the greatest upside is 3D …” He specifically highlights “… 3D chip packaging using through silicon via technology (TSV) by UMC (NYSE:UMC), STATS ChipPAC, and Tezzaron.” See the article here.