Is Tezzaron’s 3D process “monolithic”? Oct15 By Webmaster • Posted in Industry News October 15, 2015 In the world of 3D ICs, definitions tend to morph and shift at a dizzying rate. There is disagreement on such basic terms as TSV, package, stack, and even 3D itself! The recent IEEE 3D Test Workshop saw a redefinition of “Monolithic 3D IC” that would include Tezzaron’s stacking process. So, are we monolithic? And does it matter? For a good recap of the discussion, read the article in 3D InCites.