Tezzaron Acquires Texas Semiconductor Facility Oct1 By Webmaster • Posted in Press Releases October 1, 2012 Naperville, IL – October 1, 2012 Tezzaron Semiconductor has signed a contract to purchase the assets of a semiconductor technology development and wafer fabrication facility in Austin, Texas, previously run by SVTC Technologies. Tezzaron will continue the operations of this unique facility while adding capabilities to assemble its own revolutionary three … [Read More]
Want some real-world insight into 2.5D and 3D IC design and assembly? Read on to get the word from Tezzaron Semiconductor Jul12 By Webmaster • Posted in Tezzaron in the News July 12, 2012 Ann Steffora-Mutschler just published an interview with Robert Patti, chief technology officer at Tezzaron Semiconductor, that gives some terrific technical detail about 2.5D and 3D IC design and assembly. Patti provides some rare insight into today’s (as in right now) 2.5D/3D state of the art through some really interesting qualitative … [Read More]
3D Integration: New Opportunities for Speed, Power and Performance Feb7 By Webmaster • Posted in Documents February 7, 2012 A Tezzaron presentation from the 3D-IC Summer School in Buenos Aires Download PDF: 3D Integration: New Opportunities for Speed, Power and Performance
Tezzaron in the News: 2011 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2011 December 2011: Honeywell, Tezzaron Semi partner to develop 3D chips for military/aero applications (Smart Brief) December 2011: Rad-hard 3D integrated circuit design for aerospace and defense is goal of Honeywell-Tezzaron partnership (Military & Aerospace Electronics) December 2011: Honeywell taps Tezzaron Semiconductor to stack rad-hard die (ElectroIQ) December 2011: Honeywell … [Read More]
Bob Patti, Tezzaron Semiconductor, at the RTI 3D Architectures for Semiconductor Integration and Packaging 2011 Dec20 By Webmaster • Posted in Tezzaron in the News December 20, 2011 Bob Patti, CTO, Tezzaron Semiconductor, talks about the challenges and opportunities 3D integration brings to the semiconductor manufacturing industry, and Tezzaron’s role in bringing 3D IC integration to market… watch video