The Tezzblog

Finally Saying It Out Loud

Tezzaron’s first working 3D memory chip – a memory stack with through-silicon vertical interconnect – appeared in 2004. Since then our memory stacks have grown continually more sophisticated, with hugely increased capacity. Finally, at the GSA 3D IC Packaging Working Group meeting (July 23), somebody said it out loud: “Memory stacks with TSVs [through-silicon vias] are here!”

The speaker was Jan Vardaman of TechSearch International, a respected voice in the semiconductor community.  She identified Tezzaron as one of only three entities actively involved.  Read the report by Francoise Von Trapp of 3D Incites.