Where is the industry going? Feb22 By Webmaster • Posted in Industry News February 22, 2016 Among all the hype and hullabaloo, it’s wise to listen to reasoned industry voices. Here are two articles assessing the position of 3D and 2.5D today: Intercepting IC Products with a Disruptive Technology Option – by Riko Radojcic of 3D InCites Inside Advanced Packaging – an interview with … [Read More]
Nice press coverage – from Japan! Feb4 By Webmaster • Posted in Tezzaron in the News February 4, 2016 Last November Tezzaron had a presence at the SC15 conference. In January, our booth and its message received some very nice online coverage from a Japanese news site. They published a very thorough write-up with several photos. (Thank you, Mynavi!) For those who don’t read Japanese, … [Read More]
Nice little video Jan29 By Webmaster • Posted in Tezzaron in the News January 29, 2016 Last year we posted the news that Bob Patti had received the 2015 “3D InCites Individual Achievement Award.” At the request of a long-time investor, we are posting a link to the nice little video that was presented with the award. (And a special thank you … [Read More]
Early alert: 3DIC 2016 Jan27 By Webmaster • Posted in Industry News January 27, 2016 The IEEE International Conference on 3D System Integration (3DIC 2016) will be held in San Francisco on November 8-10, 2016. Conference co-chairs are Paul Franzon of NCSU and our own Bob Patti. The conference will cover all 3D-IC topics including 3D process technology, materials, … [Read More]
More Power! Jan20 By Webmaster • Posted in Tezzaron in the News January 20, 2016 If you want to go faster, you need more power. Right? Maybe not, says Jeremy Hsu, writing in IEEE Spectrum. He warns that power problems currently threaten to strangle super-fast computers. In fact, an exascale computer built with old-school technology might require its own nuclear power plant. … [Read More]