The Tezzblog

Tezzaron Wrap-Up from SC15

The Super-Computing conference in Austin — a wall-to-wall, full throttle, nonstop Geek Fest!  With nearly 13,000 attendees, it was the largest SC conference ever.  Tezzaron’s 3-story booth attracted tons of foot traffic and very positive attention.  Inside the 3D booth, our 3D technology displays included wafers with finished chips, die-on-wafer stacks, a set of our first-run DiRAM4 chips, and a chip from a 16-wafer stack.  This last, under a magnifying imager, drew great interest.  See photos below.

Building the tower

Building the tower
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Building our 3-story booth, the weekend before the show