The Tezzblog

Early alert: 3DIC 2016

The IEEE International Conference on 3D System Integration (3DIC 2016) will be held in San Francisco on November 8-10, 2016.  Conference co-chairs are Paul Franzon of NCSU and our own Bob Patti.  The conference will cover all 3D-IC topics including 3D process technology, materials, equipment, circuits technology, design methodology, and applications.  Deadline for papers and proposals is May 31, 2016 – see Call for Papers.