Surprises in 2.5D Aug18 By Webmaster • Posted in Tezzaron in the News August 18, 2015 What’s 2.5D, and why is it suddenly so poplar? Semiconductor Engineering says the stacked die approach is steadily gaining share, “but there are lots of surprises as to where, how and why.” Silicon interposers are the big winner. They quote our own Bob Patti: “People are becoming a lot more comfortable with this. … Silicon interposers are much more readily available. You can get them from foundries. We build them. … The focus is on high bandwidth, and power comes along for the ride.” See the whole article here.