3D TSV Packages Market Growth Jan31 By Webmaster • Posted in Tezzaron in the News January 31, 2017 Future Market Insights lists Tezzaron as a “leading player of this industry” in their report, 3D TSV Packages Market Growth, Forecast and Value Chain 2016-2026 More from their press release: Currently, 3D Packaging using Through Silicon Via technology (3D TSV) is one of the hottest topics in the semiconductor ecosystem. … Growing … [Read More]
Celebrating the 3D-IC Alliance Jan30 By Webmaster • Posted in Industry News January 30, 2017 In 2005, Tezzaron and Ziptronix formed the 3D-IC Alliance to promote standards in 3D IC design and manufacturing – a necessary endeavor that was not being promoted elsewhere. More than a dozen groups joined the Alliance. In 2008, the Alliance announced the first standard ever published for 3D-ICs: [Read More]
Global 3D-IC and 2.5D-IC Packaging Market Jan24 By Webmaster • Posted in Tezzaron in the News January 24, 2017 A recent publication by Absolute Reports, Global 3D IC and 2.5D IC Packaging Market Research Report 2016, lists Tezzaron as a “fundamental market player” in the 3D IC and 2.5D IC Packaging market. The report covers consumption, market share, and growth rate by package type and by … [Read More]
Tezzaron at 3D ASIP 2016 Dec29 By Webmaster • Posted in Tezzaron in the News December 29, 2016 This year’s 3D ASIP conference attracted the usual crowd of innovators and enthusiasts. Tezzaron’s CTO (Bob Patti) was in attendance, and was quoted in an entertaining report: Hugo Pristauz Drops the F-bomb at 3D ASIP 2016, You Won’t Believe What Happens Next!
Memories of the Future Nov3 By Webmaster • Posted in Tezzaron in the News November 3, 2016 Tezzaron’s 3D-IC memories are featured in the latest issue of Scientific Computing World, in the article Memories of the Future. Author Robert Roe takes a deep look, exploring new memory challenges in high-performance computing (HPC). He outlines several innovations now in development and concludes … [Read More]