The Tezzblog

Celebrating the 3D-IC Alliance

In 2005, Tezzaron and Ziptronix formed the 3D-IC Alliance to promote standards in 3D IC design and manufacturing – a necessary endeavor that was not being promoted elsewhere. More than a dozen groups joined the Alliance. In 2008, the Alliance announced the first standard ever published for 3D-ICs: IMIS™ – Intimate Memory Interface Specification.

Now, in 2017, other standards bodies have taken up the matter in earnest. Notably, both SEMI and JEDEC have active committees that produce guidelines and specifications for 3D-ICs.

The original 3D-IC Alliance has served its purpose. We thank all of its members for their active interest and participation, and congratulate them on a job well done!