The Tezzblog

Global 3D-IC and 2.5D-IC Packaging Market

A recent publication by Absolute Reports, Global 3D IC and 2.5D IC Packaging Market Research Report 2016, lists Tezzaron as a “fundamental market player” in the 3D IC and 2.5D IC Packaging market. The report covers consumption, market share, and growth rate by package type and by application; market projection and analysis; key dynamics; prime strategical activities; current market scenario; and future prospects through 2021.