Tezzaron at 3D ASIP Dec30 By Webmaster • Posted in Tezzaron in the News December 30, 2015 On Dec 15-17, RTI International hosted its twelfth conference on 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) — it’s the leading industry event in 3D integration and packaging. Tezzaron attended (as always), presented (as usual), and also sponsored the event. This year’s agenda was not … [Read More]
“The Year of 3D Memory” Dec3 By Webmaster • Posted in Industry News December 3, 2015 EE Times and EDN announced predictions for next year — specifically, 15 Hot Tech Stories for 2016 including our favorite: The Year of 3D Memory “3D ICs have been around for a while, but now they’re getting real.” Indeed they are! Tezzaron’s own [Read More]
Tezzaron Wrap-Up from SC15 Nov23 By Webmaster • Posted in Uncategorized November 23, 2015 The Super-Computing conference in Austin — a wall-to-wall, full throttle, nonstop Geek Fest! With nearly 13,000 attendees, it was the largest SC conference ever. Tezzaron’s 3-story booth attracted tons of foot traffic and very positive attention. Inside the 3D booth, our 3D technology displays included wafers with finished chips, die-on-wafer … [Read More]
Building a presence at SC15 Nov12 By Webmaster • Posted in Uncategorized November 12, 2015 Austin, Texas — Our booth is under construction! Its 3-story structure symbolizes Tezzaron’s leadership in 3D-ICs. In a few days it’ll be all gorgeous with walls & graphics. Stay tuned… Update: We’re getting attention already! “That’s crazy…How did you pull that off?” “Who designed it?” “Wow … people are going to come around … [Read More]
Fast 50! Nov2 By Webmaster • Posted in Industry News November 2, 2015 In October, Novati Technologies was named one of the Austin Business Journal’s “Fast 50” – the fastest growing companies in central Texas. For full story, click here. Big congrats to our co-workers in Texas!