The Tezzblog

“The Year of 3D Memory”

EE Times and EDN announced predictions for next year — specifically, 15 Hot Tech Stories for 2016 including our favorite: The Year of 3D Memory

“3D ICs have been around for a while, but now they’re getting real.”

Indeed they are!

Tezzaron’s own DiRAM4 is fundamentally different from all other 3D memory.  Built with wafer stacking rather than die stacking, it employs true 3D integration to function as a single circuit rather than a collection of chips.  DiRAM4 features ultra-thin layers, profuse vertical interconnect, on-board intelligence, on-the-fly repair, and blazing speed.

We are primed and ready for an exciting year.