The Tezzblog

Tezzaron at 3D ASIP

On Dec 15-17, RTI International hosted its twelfth conference on 3D Architectures for Semiconductor Integration and Packaging  (3D ASIP) — it’s the leading industry event in 3D integration and packaging.  Tezzaron attended (as always), presented (as usual), and also sponsored the event.  This year’s agenda was not so much about planning and predictions; the focus was squarely on real-world processes and results, building and delivering 3D and 2.5D devices.  3D InCites published a summary and a nice selection of images.