3D Super-Via for Memory Applications Jan31 By Webmaster • Posted in Documents January 31, 2007 A Tezzaron presentation from the 2007 Micro-Systems Packaging Initiative Workshop Download PDF: 3D Super-Via for Memory Applications Note: The demo video (3D-IC Microprocessor Prototype) referenced on page 16 is available here.
3-D Power Savings Jan31 By Webmaster • Posted in Documents January 31, 2007 A Tezzaron white paper: brief discussion of power savings enabled by 3D Download PDF: 3-D Power Savings
Tezzaron in the News: 2006 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2006 October 2006: Designing in the Third Dimension (EDN Asia) October 2006: Wafer-Level 3-D Integration Moving Forward (Semiconductor International) August 2006: 3-D Requires System Rethink (EE Times) June 2006: Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs (Proceedings of the IEEE, Vol. 94, No. 6) March 2006: IME … [Read More]
Tezzaron in the News: 2005 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2005 November-December 2005: 3D Integration (IEEE Design & Test special issue) October 2005: Real Demand Drivers Appear for 3D ICs… (Wafer News and Solid State Technology) June 2005: Startup Profiles: Tezzaron (Semiconductor Times) June 2005: Three-Dimensional ICs Solve the Interconnect Paradox (Semiconductor International) May 2005: Terrazon [sic] applies 3D stacking … [Read More]
Tezzaron Inks Sales Rep Contracts for SRAM Sep19 By Webmaster • Posted in Press Releases September 19, 2005 Naperville, IL – September 19, 2005 Tezzaron’s memory products have attracted a team of world-class sales firms, giving the company an outside sales force of more than 50 people. The team includes Centaur North, Electronics Sales Professionals (ESP), Synergy Technical Sales, and TriStar Group. The firms average over 15 years’ experience … [Read More]