The Tezzblog

Tezzaron in the News: 2006

October 2006: Designing in the Third Dimension (EDN Asia)

October 2006: Wafer-Level 3-D Integration Moving Forward (Semiconductor International)

August 2006: 3-D Requires System Rethink (EE Times)

June 2006: Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs (Proceedings of the IEEE, Vol. 94, No. 6)

March 2006: IME Signs MOU with Tezzaron to Further Research Collaborations (IME website)

March 2006: 3D Integration at the Wafer Level (TechSearch International)

January 2006: Sematech targets infrastructure for 3-D chips (EE Times)