Tezzaron in the News: 2013 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2013 December 2013: 2.5-D Stacks Pile Up at Event (EE Times) December 2013: Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action (3D InCites) December 2013: Invensas and Tezzaron Partner to Deliver Commercial 3D IC Products (3D InCites) December 2013: Ziptronix Teams with Tezzaron and Novati Technologies … [Read More]
3D ASIP Dec12 By Webmaster • Posted in Tezzaron Presents December 12, 2013 Tezzaron presents “Evolving 2.5D and 3D Integration” at 3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
Invensas Teams with Tezzaron Dec12 By Webmaster • Posted in Press Releases December 12, 2013 Invensas announced that it is partnering with Tezzaron to build a wide range of 3D-IC customer products. Robert Patti of Tezzaron: “Today we can produce complete high-quality 2.5D (Silicon Interposer) and 3D silicon devices, but the final packaging flows are lacking. Invensas’ 3D-IC packaging expertise and existing pilot assembly line … [Read More]
Ziptronix Teams with Tezzaron and Novati Technologies to Accelerate Development of 3D ICs Dec9 By Webmaster • Posted in Press Releases December 9, 2013 Sells 3D IC development lab to Tezzaron; Novati Technologies to operate facility Ziptronix Inc., provider of patented, low- temperature direct bonding technology for 3D integration, today announced an agreement with Tezzaron Semiconductor Corporation and Novati Technologies, a wholly owned subsidiary of Tezzaron, as a next step toward the acceleration of 3D … [Read More]
IEEE Santa Clara Valley Presentation Nov13 By Webmaster • Posted in Slide Presentations November 13, 2013 IEEE Santa Clara Valley PDF Presentation: Design, Manufacturing and Performance of a 3D Random Access Memory Subsystem