Tezzaron and Rambus Ink Agreement Jan23 By Webmaster • Posted in Press Releases January 23, 2015 Tezzaron and Rambus announce an agreement enabling Tezzaron to implement ReRAM in its own products. ReRAM is a Rambus non-volatile oxide-resistive memory technology with significant power and speed advantages. The agreement also enables Tezzaron’s manufacturing subsidiary, Novati, to build ReRAM into its customers’ devices. Read the press release here: [Read More]
What’s Hot in 2015? Jan21 By Webmaster • Posted in Industry News January 21, 2015 It’s January, so pundits of all stripes are publishing their predictions for the year ahead. (Spoiler: 3D is hot!) Solid State Technology collected the opinions of several leading lights in 2015 outlook: Tech trends and drivers Semiconductor Engineering’s Brian Bailey reports Manufacturing And Packaging Changes For 2015 For more, … [Read More]
3D-IC Meeting in Kinsale, Ireland Jan19 By Webmaster • Posted in Industry News January 19, 2015 The IEEE International Conference on 3D System Integration (3DIC) was held in Kinsale, Ireland, on 1-3 December 2014. Tezzaron was on the organizing committee. The event was reported by Peter Ramm in 3D InCites: Popping the Cork on 3D IC at IEEE 3DIC 2014 and by Phil Garrou … [Read More]
Getting Down to Business at 3D ASIP Dec30 By Webmaster • Posted in Industry News December 30, 2014 Tezzaron was a Platinum Sponsor for RTI’s 3D ASIP conference on December 10-12. This was the eleventh year for 3D ASIP (3D Architectures for Semiconductor Integration and Packaging) and the eleventh year of Tezzaron’s participation. As always, the event offered excellent presentations by several industry leaders … [Read More]
Tezzaron participates in 3D InCites panel at IWLPC Nov17 By Webmaster • Posted in Tezzaron in the News November 17, 2014 The annual International Wafer-Level Packaging Conference (IWLPC) brings together some of the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D, TSV, and MEMS device packaging. This year’s event, held Nov 11 in San Jose, featured a panel discussion: System Level Advantages of … [Read More]