Tezzaron participates in 3D InCites panel at IWLPC Nov17 By Webmaster • Posted in Tezzaron in the News November 17, 2014 The annual International Wafer-Level Packaging Conference (IWLPC) brings together some of the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D, TSV, and MEMS device packaging. This year’s event, held Nov 11 in San Jose, featured a panel discussion: System Level Advantages of 3D Integration sponsored by 3D InCites. One of the panelists was Tezzaron’s CTO, Bob Patti (pictured at center, in red shirt). Highlights of the panel were reported by Herb Reiter: Kahoots from the IWLPC 3D InCites Panel.