3D-IC Meeting in Kinsale, Ireland Jan19 By Webmaster • Posted in Industry News January 19, 2015 The IEEE International Conference on 3D System Integration (3DIC) was held in Kinsale, Ireland, on 1-3 December 2014. Tezzaron was on the organizing committee. The event was reported by Peter Ramm in 3D InCites: Popping the Cork on 3D IC at IEEE 3DIC 2014 and by Phil Garrou in Solid State Technology: IEEE 3DIC – Cork