The Tezzblog

Paula Doe, technology director at SEMI, published a SEMICON West Preview on May 5.  It featured a good summary of our oxygen vacancy ReRAM effort, including this line:  “Patti says his company’s aerospace/military customers, who … [Read More]

A multi-project wafer (MPW) is a vehicle that allows several entities to share the costs and risks of building prototypes.  Tezzaron has participated in several MPWs for 3D-IC prototypes.  A valuable partner is CMP (Circuits Multi Projets) in France.  Kholdoun Torki of CMP gives an excellent description of the 3D … [Read More]

Grenoble (France) hosted this year’s Design, Automation, and Test in Europe (DATE) conference and exhibition.  The conference featured tutorials and technical sessions that attracted 1450 experts from around the world.  The last day of the conference included a 3D Integration Workshop at which Tezzaron presented: How … [Read More]

Last week we announced an agreement with Rambus.  This week EE|Times covers our announcement in detail:

‘Tezzaron Semiconductor will be the first customer to incorporate Rambus oxide-resistive memory (ReRAM) technology in forthcoming devices … Bob Patti, Tezzaron’s CTO, said the company sees short-term potential … [Read More]

How trustworthy is an integrated circuit?  That depends.  Who designed it?  Who built it?  Whose software was embedded in it?  Whose hands were on it during the whole process?  Could confidential functionality have been compromised along the way?

Chips that are implemented in critical systems need a very high degree of … [Read More]