About Our 3D Multi-Project Wafers (MPWs) Apr18 By Webmaster • Posted in Tezzaron in the News April 18, 2015 A multi-project wafer (MPW) is a vehicle that allows several entities to share the costs and risks of building prototypes. Tezzaron has participated in several MPWs for 3D-IC prototypes. A valuable partner is CMP (Circuits Multi Projets) in France. Kholdoun Torki of CMP gives an excellent description of the 3D MPW process: Executive Viewpoint: Inside a Multi-Project Wafer Program for 3D Integration