The Tezzblog

If it seems like the whole world is jumping on the 3D bandwagon — well, it is!  But one of the earliest advocates, and also one of the most powerful, is DARPA (Defense Advanced Research Projects Agency).  This US agency has cultivated, funded, and supported cutting-edge research ever … [Read More]

“Once you’ve made the decision to go 3D there’s no way back.”
That’s the word from Eric Beyne, Scientific Director Advanced Packaging & Interconnect for imec.  He went on to say: “If you need high-bandwidth memory, for example, then you’re committed to some sort of 3D.”

We couldn’t agree more!

Read … [Read More]

This year’s InterPACK (International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems) is July 6-9 in San Francisco, held jointly with the International Conference on Nanochannels, Microchannels and Minichannels (ICNMM).  It promises a fascinating array of papers, presentations, seminars, speakers, tutorials, and workshops.  … [Read More]

April 27-29 2015 saw the Vth INFIERI Workshop in Geneva, Switzerland – home of CERN and its Large Hadron Collider.  The high-level workshop was organized by the INFIERI consortium. Three days of plenary sessions covered the latest developments in detectors, imaging, data … [Read More]

Monolithic 3D (M3D), wafer-stacking with TSV (3DIC), and other buzz-worthy technologies are examined in the latest blog entry by Françoise von Trapp – “Queen of 3D.” She quotes some leading industry experts and notes: “Tezzaron’s 1µm tungsten TSVs are another attractive alternative in between 3DIC and M3D … currently, the … [Read More]