The Tezzblog

Tezzaron’s 3D Processes & Patents

Bill Martin discussed (in 3D InCites) the IP and patent landscape of electronic system development. One case in point was a comparison of the 3D processes used by Tezzaron and Monolithic 3D. He concludes that the two companies “do not need to chase the smaller nodes … that require higher costs.” Read his article: Silicon Patents: Repeating the Past.

Tezzaron’s 3D process also earned a mention in another 3D InCites story, The Edge of 3D by Francoise von Trapp, as a method to achieve 3D system-on-chip very large scale integration (3D SoC VLSI).