The Tezzblog

Temporary Bond / DeBond – Why Bother?

“What we need is an approach that eliminates temporary bond/debond and allows scaling of the wafer thickness.” — Sitaram Arkalgud, as quoted by F. von Trapp, who reports that Surya Bhattacharya agreed with this assessment during the 3D IC Forum at SEMICON Singapore.

One solution described in the forum was Tezzaron’s FaStack® process, in which wafers or dies are permanently bonded before thinning.

Read the article in 3D InCites.