The Tezzblog

Permanent Wafer Bonding

There are many ways to stick two wafers together.  Tezzaron uses two permanent bonding methods: copper thermo-compression and copper/oxide “hybrid” – the latter developed by Ziptronix and licensed to us.  Hybrid bonding gets a vote of confidence in Amandine Pizzagalli’s recent summary (in 3D InCites): Market Outlook for Permanent Wafer Bonding