The Tezzblog

Looking Back on a Major Milestone

Ten years ago today — on 21 October 2004 — Tezzaron demonstrated the world’s first working 3D-IC!

The device was a two-layer wafer-stacked chip with tungsten SuperContact™ (vertical interconnect).  It was part of an in-house multi-project wafer stack containing six different 3D designs, all of which were first-pass functional.  The first to test out was the simplest, pictured above: a memory register.  This ground-breaking proof-of-concept was the ancestor of all our successful 3D-ICs.  Immersed in exciting new projects, we take a moment to look back and rejoice.

Happy birthday, 3D-IC!