Press Releases

Naperville, IL – September 19, 2005

Tezzaron’s memory products have attracted a team of world-class sales firms, giving the company an outside sales force of more than 50 people. The team includes Centaur North, Electronics Sales Professionals (ESP), Synergy Technical Sales, and TriStar Group. The firms average over 15 years’ experience … [Read More]

Naperville, IL – May 9, 2005

Two innovative young companies, Tezzaron Semiconductor and Programmable Integrated Circuit Company (PICC), intend to collaborate on the creation of 3D flash memory components. The companies have executed a Letter of Intent outlining their agreement.

PICC, a new “fabless” semiconductor company, owns patented flash technology that employs … [Read More]

Technologies called “compatible and complementary”

28 February 2005

Two leading forces in 3D integrated circuits, Tezzaron and Ziptronix, today announced their intent to cooperate in joint development and marketing efforts. As pioneers in 3D IC technology, both companies are working towards a general industry adoption of 3D solutions. The collaboration … [Read More]

Third 3D IC Confirms FaStack™ Process

Naperville – 24 January 2005

Tezzaron Semiconductor has built a 1 Megabit SRAM as a three-dimensional integrated circuit (3D IC). This new device, the third design to be built in Tezzaron’s FaStack wafer stacking process, uses a 100-pin TQFP package with industry standard pinout and interface.

Tezzaron … [Read More]

Singapore – 23 December 2004

Tezzaron® Semiconductor announced that its 3D technology is ready to launch the semiconductor industry into a new era. “Migration from 2D to 3D is inevitable,” says Dr. Subhash Gupta, Managing Director. His confidence is based on the success of Tezzaron’s first six prototype designs, which demonstrated … [Read More]